S･Pot
Desktop manual molding machine ideal for development
The top and bottom molds are around 8 kg, making it easy to swap them out.
Ideal for package development, resin characteristics evaluation, and other applications.
Feature 1: Small molding machine ideal for prototype molding
The machine is easy to install and also relocate, even on the second floor of a building. This is thanks to it having a light weight of 500 kg or less, it is installed on a base equipped with castors, and can be also used for vacuum assisted molding.
The machine has plug-and-play-support making it easy to use, combined with high maintainability.
Feature 2: Small single pot mold
The top and bottom molds are both lightweight at approximately 8 kg, making it easy to swap them out. It supports a wide range of development items, including MUF molding, exposed molding and low-profile packaging.
Feature 3: A variety of molding options
FAM (Film assisted system)
VAM (vacuum assisted molding)
Feature 4: Resin characteristics evaluation system (optional)
A dedicated mold can be mounted to suit the shape required, and resin data can be collected by incorporating the desired software.
Specifications
| Clamp Force | Model Name（press） | Machine Size（mm） | Weight | Max. L/F Size（mm） | |
|---|---|---|---|---|---|
| 8ton | S・pot | （1press） | W:330×L:1100×H:725 | 0.3ton | W:15-75 |
List of products
Semiconductor molding machines
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GP-PRO SP Series
An automatic molding system suitable for mass production.
The company has implemented thorough dust protection to enhance reliability and meets a wide range of needs for high quality, from consumer ICs to automotive ICs and passive components.
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GP-PRO sf Series
A compact, full-automatic molding system dedicated to high-mix low-volume production.
The sf40 (one-strip type), and two sf120 models (two-strip type) are available.
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GP-PRO sa Series
Automatically transfers the lead frame and resin to the mold which are then automatically processed.
After molding, the product is removed manually in a two-strip semi-automatic molding system.
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GP-PRO LAB Series
A manual molding system that offers a wide range of options from development to specialized applications.
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GP Molds
Precision molds for semiconductor packaging. Our unique Clamp Control Floating Chase (CCFC) and other mechanisms are available to handle all packages.
Semiconductor related equipment
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TS-PRO
TS-PRO is a machine that is a global standard for applying Quad Flat No leaded package (QFN) back tape.
By applying back tape after wire bonding, the problems that occur relating to tape are solved, and it contributes to substantial cost reductions.
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DS-PRO
A machine that automatically strips QFN back tape. Compatible with both slit and stack magazines. The machine automatically strips off tape that has been securely applied.
